Hewlett Packard Enterprise ProLiant DL365 Gen11 9224 2.5GHz 24c 64GB-R 8SFF MR408i-o 2x480GB SATA SSD 2x1000W PS EU Server

Name: Hewlett Packard Enterprise ProLiant DL365 Gen11 9224 2.5GHz 24c 64GB-R 8SFF MR408i-o 2x480GB SATA SSD 2x1000W PS EU Server
Brand: Hewlett Packard Enterprise
Availability: InStock

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Are you looking for a scalable, compute-dense solution for high-performance workloads? The HPE ProLiant DL365 Gen11 server is a rack-optimized 1U 2P dense solution that delivers exceptional compute performance, upgraded high-speed data transfer rate and memory depth at 2P compute capability. Powered by 4th & 5th Generation AMD EPYC 9004 & 9005 Series Processors with up to 160 cores, increased memory bandwidth and capacity, high-speed PCIe Gen5 I/O, Enterprise and Datacenter Standard Form Factor (EDSFF) and GPU support, the HPE ProLiant DL365 Gen11 server is a superb rack-optimized, 1U 2P, dense solution. Enhanced security features with the HPE silicon root of trust are built into the firmware, creating a digital fingerprint for the AMD Secure Processor to validate safe operation prior to boot. Supports Direct Liquid Cooling (DLC) for enhanced power usage effectiveness and reduce cooling costs.

What is new supporting point:
Powered by 4th and 5th Generation AMD EPYC 9004 & 9005 Series Processors with 5nm technology that supports up to 160 cores at 400W, 1152 MB of L3 cache, and 24 DIMMs for DDR5 memory up to 6400 MT/s.
12 DIMM channels per processor for up to 6 TB total DDR5 memory with increased memory bandwidth and performance, and lower power requirements.
Advanced data transfer rates and higher network speeds from the PCIe Gen5 serial expansion bus, with up to 2x16 PCIe Gen5 and 2 OCP slots.
Includes HPE Integrated Lights-Out 6 (iLO 6) server management software that enables you to securely configure, monitor, and update your HPE ProLiant Gen11 servers seamlessly from anywhere.
EDSFF drive support for higher density and performance options.
Supports Direct Liquid Cooling (DLC) for enhanced power usage effectiveness and reduce cooling costs.