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BGA 植球套件

正常价格 $75.00

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BGA 植球套件

BGA 植球套件

$75.00

BGA 植球套件

特征:

  • 材料: 全铝镀层,耐氧化,耐磨。
  • 兼容性: 适合芯片尺寸从5毫米到50毫米,适用于台式电脑、笔记本电脑、BGA芯片和手机。
  • 可调节性: 包括带有刻度的可调节平面螺丝,用于精确测量。
  • 方面: 90mm x 90mm 植球站。

包括:

  • 模板:0.3mm、0.35mm、0.4mm、0.45mm、0.5mm、0.55mm、0.6mm(通用、0.9、1.0)、0.76mm
  • 手柄和六角扳手,方便操作。

该套件的设计注重耐用性和易用性,非常适合精确的 BGA 植球任务。